SMT PCBA Manufacturer,EMS Assembly Services,PCBA Products,PCBA Process - First Creation Industry

via：https://www.qualitymag.com/articles/94586-flextron-adds-3d-spi-aoi-inspection

CHICAGO – Flextron Circuit Assembly added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines to enhance quality and reliability in its finished electronic assemblies.
Flextron deployed two 3D SPI systems from Koh Young Technology in addition to post-soldering Automated Optical Inspection (AOI) provided by a Nordson YESTECH F1S AOI system. The two KY8030-2 full 3D SPI systems provide inspection for defects and measurement data of printed solder paste, identifying defects such as insufficient paste volumes, missing prints, and print registration errors.
“Solder Paste Inspection, really measurement, is one of the most powerful process optimization tools that a PCBA manufacturer can have in his arsenal, given that fully 70% of all soldering defects originate at the solder paste printing step,” said Jay Vora, VP sales and engineering. “Our Koh Young 3D SPI systems actually measure the solder paste volume deposited on the individual pads."
Flextron’s YESTECH YTV F1S PCB AOI machine examines PCBAs further downstream, after the components have been attached (soldered) to the assembly. The AOI system uses machine vision to look for solder defects, lead defects, component presence and position, correct part or polarity, and more.


KeyWords Tag：Surface-mount Technology